| Item |
Content |
Specification |
| 1 |
Layer |
1～6 layers for FPC(2~12 layers for Rigid-Flex) |
| 2 |
Dimension of Finished Board (Utmost) |
250* 400mm |
| 3 |
Board Ply (maximum) |
0.4mm |
| 4 |
Board Ply ( minimum ) |
0.05mm |
| 5 |
Tolerance of Thickness of Finished Product (0.075mm Board Ply < 0.4mm ) |
± 0.03mm |
| 6 |
Hole Diameter ( minimum ) |
0.20mm |
| 7 |
Diameter of Finished Hole ( minimum ) |
0.25mm |
| 8 |
Thickness of Base Copper( minimum ) |
1/ 3oz |
| 9 |
Thickness of Base Copper ( maximum ) |
1oz |
| 10 |
Dielectric Thickness ( minimum ) |
1/2mil |
| 11 |
Dielectric Thickness ( maximum ) |
3mil |
| 12 |
Material |
PI/ PET |
| 13 |
Hole Plating Aspect Ratio ( maximum ) |
7:1 |
| 14 |
Hole Diameter Tolerance ( PTH ) |
± 0.050mm |
| 15 |
Hole Diameter Tolerance ( non-PTH ) |
± 0.050mm |
| 16 |
Hole Position Tolerance( Compared with CAD ) |
± 0.076mm |
| 17 |
PTH Wall Thickness |
≥0.015mm |
| 18 |
Designed Conductor Width/ Space (Minimum) |
1/2oz 4mil/4mil
1/3oz 3mil/3mil
( 0.076mm / 0.076mm ) |
| 19 |
Tolerance of Line Width |
± 20%( normal ) |
| 20 |
Solder Mask Thickness ( minimum ) |
7.6um （line angle） |
| 21 |
Thickness and Tolerance of Nickel Plated Gold Finger |
2.54um~~5um |
| 22 |
Thickness and Tolerance of Gold- Plated Gold Finger |
0.025um ~~0.2um |
| 23 |
Thickness of Immersion Nickel/ Gold (Minimum- Maximum) |
2.54um~5um/0.025um~0.1um |
| 24 |
Tolerance of Punch Hole Diameter |
± 0.05mm |
| 25 |
Outline Tolerance (Fine Steel Mould) |
± 2mil( ± 0.05mm ) |
| 26 |
Outline Tolerance (Steel Mould) |
± 4mil( ± 0.1mm ) |
| 27 |
Outline Tolerance (Knife Mould) |
± 12mil( ± 0.3mm ) |
| 28 |
Impedance Tolerance of Finished Board (Minimum) |
± 10% |
| Others |
Item |
Content |
| 1 |
Circumference Void Test Voltage |
200 ± 5V |
| 2 |
Short-Circuited Resistance |
10M Ω |
| 3 |
Open-Circuited Resistance |
30 Ω |
| 4 |
Solderability Test |
260 ± 10 ℃ ,Time: 10Sec |
Note：
1.Lead time for samples: Single-sided Board: 2-3 days; Double- sided Board: 3-5 Days; Multi-layer Board: 6-7 days. For manual samples, the cap is 5 verities.
2.Lead time for mass production: Single and double-sided Boards: 6-7 days; Multilayer Boards: 8-10 days; and for the mass-produced boards, the mould must be made for production |
